Die sorting, Wafer Reconstruction (RECON)
Key Feature
- Auto alignment
- Up to 12” wafer
- Chip size: Up to 7000um x 7000um
- Fully Automation
- Real-time data management
- Flexibility of output form (Metal frame, Grip ring, GEL PAK, WAFFLE PAK, etc…)
+886-3-327-9600
7F and 8F., No. 99, Wenxin Rd., Guishan Dist., Taoyuan City 333001, Taiwan333001桃園市龜山區文信路99號7、8樓