Die sorting, Wafer Reconstruction (RECON)

Key Feature

  • Auto alignment
  • Up to 12” wafer
  • Chip size: Up to 7000um x 7000um
  • Fully Automation
  • Real-time data management
  • Flexibility of output form (Metal frame, Grip ring,  GEL PAK, WAFFLE PAK, etc…)
68,Hwa-Ya 1st Road, Hwa-Ya Technology Park, Taoyuan Hsien 333, Taiwan

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