|  | | |
|---|---|---|---|
Brand / Model / Name | Chroma 3650 | Chroma 3360 | Chroma 3160 |
Core Test Services
Testar provides Semiconductor Testing Service in Wafer Probing and Final Testing.
Our testing service covers a wide range of applications, such as logic devices, MCU, Interface controller IC, sensor controller, A/D and D/A converter,... etc. Which are mainly used in consumer electronics and communication devices.
Testar is capable to handle 5, 6, 8 and 12" wafers with inkless or off-line ink process inside our class-1K environment. Our Final Testing Service performs electrical testing as well as customized test items, program and parameters. The pick-and-place handler could cover diversified package type of devices.
Testar Semiconductor Tesing also provides below Engineering services to make your device fast "Time to Market".
Our testing service covers a wide range of applications, such as logic devices, MCU, Interface controller IC, sensor controller, A/D and D/A converter,... etc. Which are mainly used in consumer electronics and communication devices.
Testar is capable to handle 5, 6, 8 and 12" wafers with inkless or off-line ink process inside our class-1K environment. Our Final Testing Service performs electrical testing as well as customized test items, program and parameters. The pick-and-place handler could cover diversified package type of devices.
Testar Semiconductor Tesing also provides below Engineering services to make your device fast "Time to Market".
- Test program development
- Test program conversion
- Test Time reduction
- DFT consultant
- Multi-Site Testing development
Chroma 3650
SoC Test System
- 50 / 100 MHz clock rate;
- 100 / 200 Mbps (MUX) data rate
- Up to 640 digital I/O pins (testhead 2)
- 32 MW vector memory
- 32 MW pattern instruction memory
- Per-pin timing / PPMU / frequency measurement
- Scan features to 2G depth per scan chain
- ALPG option for memory test
- Up to 40 high-voltage pins
- Up to 8-32 16-bit ADDA channels option
- 32 high-performance DPS channels
- Edge placement accuracy ±300ps
- 32-CH HDADDA mixed-signal option
- 8-CH AWG and digitizer ASO mixed-signal audio band test option
- 40A pulse at 60V for MPVI analog option
- 32-CH / board for VI45 analog option
- 8-CH / board for PVI100 analog option
- MRX option for 3rd party PXI instruments
- Microsoft Windows® 7 / Windows® 10
- C++ and GUI programming interface
- CRISP, full suite of intuitive software tools
- Test program and pattern converters for other platforms
- Accept DIB and probe card of other testers directly
- Support STDF data output
- Air-cooled, small footprint tester-in-a-test-head design
Chroma 3360
VLSI Test System
- 50 MHz Test Rate(100Mhz HSCLK)
- 608 I/O channels
- 8~16 M Pattern Memory
- Flexible Configuration (Interchangeable I/O, UVI, ADDA and LCD)
- Parallel Testing for 32 devices
- Real Parallel Trim/Match function
- Accepts SC312, TS670 probe card
- Test program/pattern converter (V7, TRI6020, V50, SC312, J750, ITS9K, TS670, ND1)
- Analog PE card option (16 bit~24bit)
- SCAN test option (512M)
- ALPG test option for Memory
- STDF tools support
- User friendly Windows XP environment
- CRAFT C/C++ programming language
- Real time pattern editor with fail pin/fail address display
- Versatile test analysis tools: Shmoo plot, Waveform display, Wafer Map, Pin Margin, Scope tool,Histogram tool and etc.
Chroma 3160
(Fingerprint) Quad Site Final Test Handler
- Flexible DUT Configuration
- Adjustable P&P Interval
- Air damper buffer to reduce contact force impact
- Intelligent socket IC leftover check
- Auto Contact Force Learning
- Color Tray Mode availability
- Yield Monitor (per contact dead)
- Yield Control (average yield rate of socket)
- Compatible change kits with NS-5000 / 6000 / 6040