Die sorting, Wafer Reconstruction (RECON)
Key Feature
- Auto alignment
- Up to 12” wafer
- Chip size: Up to 7000um x 7000um
- Fully Automation
- Real-time data management
- Flexibility of output form (Metal frame, Grip ring, GEL PAK, WAFFLE PAK, etc…)
+886-3-327-9600
68,Hwa-Ya 1st Road, Hwa-Ya Technology Park, Taoyuan Hsien 333, Taiwan
333桃園市龜山區華亞科學園區華亞一路68號
333桃園市龜山區華亞科學園區華亞一路68號